TITLE

Thermal annealing of buried Al barrier layers to passivate the surface of copper films

AUTHOR(S)
Ding, P.J.; Wang, W.
PUB. DATE
October 1994
SOURCE
Applied Physics Letters;10/3/1994, Vol. 65 Issue 14, p1778
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
Investigates annealed metallic bilayers consisting copper/aluminum/ silicon dioxide. Provision of surface passivation and diffusion barrier/adhesion promoter function for advanced copper based metallization; Proximation of the resistivity of annealed films; Comparison of samples with pure copper films.
ACCESSION #
4241391

 

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