TITLE

New lead-free, Sn-Ag-Zn-Cu solder alloy with improved mechanical properties

AUTHOR(S)
McCormack, M.; Kammlott, G.W.
PUB. DATE
September 1994
SOURCE
Applied Physics Letters;9/5/1994, Vol. 65 Issue 10, p1233
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
Investigates the mechanical properties of a lead-free tin-silver-zinc-copper solder alloy. Effects of adding small amounts of copper to the solidification microstructure; Implication for grain size refinement and precipitate distribution; Disadvantages of adding excess amounts of copper and zinc beyond the one percent level.
ACCESSION #
4241343

 

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