TITLE

Formation of TiN-encapsulated copper structures in a NH[sub 3] ambient

AUTHOR(S)
Jian Li; Mayer, J.W.
PUB. DATE
June 1992
SOURCE
Applied Physics Letters;6/15/1992, Vol. 60 Issue 24, p2983
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
Examines the formation of titanium nitride (TiN)-encapsulated copper structures in a NH[sub 3] ambient. Significance of copper for ultra-large-scale integration applications; Advantages of copper over aluminum; Problems encountered in fabricating circuit interconnects with copper; Formation of a TiN barrier layer by nitridation.
ACCESSION #
4241258

 

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