Pd/Si plasma immersion ion implantation for selective electroless copper plating on SiO[sub 2]

Meng-Hsiung Kiang; Lieberman, Michael A.
June 1992
Applied Physics Letters;6/1/1992, Vol. 60 Issue 22, p2767
Academic Journal
Investigates the selective deposition of copper (Cu) in silicon oxide (SiO[sub 2]) trenches using palladium/Si plasma immersion ion implantation and electroless Cu plating. Formation the seed layer for electroless Cu plating on SiO[sub 2]; Requirements for the initiation of Cu electroless plating; Anisotropic etching of the oxide trenches.


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