Thermal-stress-induced voiding in narrow, passivated Cu lines

Borgesen, P.; Lee, J.K.
April 1992
Applied Physics Letters;4/6/1992, Vol. 60 Issue 14, p1706
Academic Journal
Analyzes the thermal-stress-induced voiding in narrow, passivated copper lines. Copper as an alternative to aluminum-based metallizations; Sensitivity of thermal-stress-induced void nucleation to cooling rates; Observation on the void growth during room temperature storage.


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