TITLE

Cu crystallographic texture control in Cu/refractory-metal layered structure as interconnects

AUTHOR(S)
Abe, Kazuhide; Harada, Yusuke
PUB. DATE
November 1997
SOURCE
Applied Physics Letters;11/10/1997, Vol. 71 Issue 19, p2782
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
Investigates the effect of underlayer texture on copper (Cu) film orientation. Dependence of the crystallographic orientation of Cu films on the underlayer refractory material; Control of Cu orientation by changing the preferred orientation of titanium nitride (TiN) underlayer; Value of the rotational angle between Cu (111) and TiN (111) planes.
ACCESSION #
4227839

 

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