Vertical and lateral hole aluminum filling characteristics employing electron cyclotron

Shingubara, S.; Morimoto, N.
August 1993
Applied Physics Letters;8/9/1993, Vol. 63 Issue 6, p737
Academic Journal
Investigates the filling of submicrometer vertical and lateral holes by employing electron cyclotron resonance aluminum sputtering. Formation of dense aluminum islands of the contact holes; Distribution of the microwave electric field; Estimation of the activation energy of the filling process.


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