Fatal electromigration voids in narrow aluminum-copper interconnect

Rose, J.H.
November 1992
Applied Physics Letters;11/2/1992, Vol. 61 Issue 18, p2170
Academic Journal
Examines the shape and crystallography of fatal electromigration void in near-bamboo aluminum-2 wt % copper thin-film conductors using transmission electron microscopy. Shapes of the fatal voids; Direction of the void formation; Inclination of void faces in grains of varying surface crystallographic orientation; Independence of void morphology.


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