Metal deposition onto oxides: An unusual low initial sticking probability for copper on SiO[sub 2]

Xueping Xu; Goodman, D. Wayne
October 1992
Applied Physics Letters;10/12/1992, Vol. 61 Issue 15, p1799
Academic Journal
Examines the deposition of copper on thin silica film. Use of temperature programmed desorption to measure the initial sticking probability of copper; Factors contributing to errors in estimating metal growth rate; Attribution of adsorbed water to the initial sticking probability.


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