Significantly improved mechanical properties in Pb-free, Sn-Zn-In solder alloy by Ag doping

McCormack, M.; Kammlott, G.W.
August 1994
Applied Physics Letters;8/29/1994, Vol. 65 Issue 9, p1100
Academic Journal
Demonstrates the modification of the dendritic solidification structure present in the tin-zinc-indium alloy by doping. Origin of the lead-free solder; Potential of lead-free solder as replacement for lead-tin solders; Improvement of the tensile ductibility; Elimination of the coarse planar features and nonuniformities within the microstructure.


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