On the bamboo structure as the salvation of thin film metallization for deep submicron device

Kuan-Yu Fu
August 1994
Applied Physics Letters;8/15/1994, Vol. 65 Issue 7, p833
Academic Journal
Presents the Dreyer-Fu-Varker model for the projection of electromigration in thin film metallization interconnects. Evolution of the very-large-scale integration technology; Relationship between the shape factor and line width with the temperature standard deviation; Observation of current density drop with line width in the submicron region.


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