Extension of infrared-laser interferometric thermometry to silicon wafers polished on only one side

Donnelly, V.M.
September 1993
Applied Physics Letters;9/6/1993, Vol. 63 Issue 10, p1396
Academic Journal
Extends interferometric thermometry to silicon wafers polished on one side. Contrast between constructive and destructive interference; Measurement of semiconductor wafer temperature during thin film deposition; Effects of the films on the polished surface.


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