TITLE

Dishing effects in a chemical mechanical polishing planarization process for advanced trench

AUTHOR(S)
Yu, C.; Fazan, P.C.
PUB. DATE
September 1992
SOURCE
Applied Physics Letters;9/14/1992, Vol. 61 Issue 11, p1344
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
Investigates the dishing effects in the chemical mechanical polishing of oxide films. Measurement of the degree of dishing for field widths ranging from .03 to 4 mum; Relationship between the degree of dishing and completion of planarization in a large field oxide region; Reduction of trench isolation effect in small field geometries.
ACCESSION #
4217970

 

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