Finite-element modeling of stress distribution and migration in interconnecting studs of a

Shi, L.T.; Tu, K.N.
September 1994
Applied Physics Letters;9/19/1994, Vol. 65 Issue 12, p1516
Academic Journal
Examines stress distribution and migration in interconnecting studs of a three-dimensional multilevel device structure. Correlation between calculated locations of stress and observed failure sites; Details on the failure mechanisms associated with different stress components; Effects of temperature on the calculated locations of stress concentration.


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