TITLE

Finite-element modeling of stress distribution and migration in interconnecting studs of a

AUTHOR(S)
Shi, L.T.; Tu, K.N.
PUB. DATE
September 1994
SOURCE
Applied Physics Letters;9/19/1994, Vol. 65 Issue 12, p1516
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
Examines stress distribution and migration in interconnecting studs of a three-dimensional multilevel device structure. Correlation between calculated locations of stress and observed failure sites; Details on the failure mechanisms associated with different stress components; Effects of temperature on the calculated locations of stress concentration.
ACCESSION #
4207657

 

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