Lead-free connector design for heat-sensitive applications

Brinkman, Don
March 2009
Electronics Weekly;3/18/2009, Issue 2375, p16
Trade Publication
The article discusses lead-free alternatives for heat-sensitive applications. The author observes that the restriction of hazardous substances (RoHS) directive has made the electronics and manufacturing industries to be more involved with the manufacturing process. It is stated that lead free alternatives are likely to increase solder-reflow temperatures, reduce elasticity, heighten moisture sensitivity levels and also increase cost.


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