TITLE

Lead-free connector design for heat-sensitive applications

AUTHOR(S)
Brinkman, Don
PUB. DATE
March 2009
SOURCE
Electronics Weekly;3/18/2009, Issue 2375, p16
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
The article discusses lead-free alternatives for heat-sensitive applications. The author observes that the restriction of hazardous substances (RoHS) directive has made the electronics and manufacturing industries to be more involved with the manufacturing process. It is stated that lead free alternatives are likely to increase solder-reflow temperatures, reduce elasticity, heighten moisture sensitivity levels and also increase cost.
ACCESSION #
38125013

 

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