The influence of nanoscale atomic-layer-deposited alumina coating on the fatigue behavior of polycrystalline silicon thin films

Budnitzki, M.; Pierron, O.
April 2009
Applied Physics Letters;4/6/2009, Vol. 94 Issue 14, p141906
Academic Journal
The influence of atomic-layer-deposited alumina surface coatings on the fatigue of polycrystalline silicon thin films was investigated. Tests were performed on 2-μm-thick notched cantilever-beam structures actuated at resonance (∼40 kHz) that were coated with ∼20 nm of alumina deposited at 100 °C. The coated devices show a drastically different frequency evolution behavior as compared to uncoated specimens, while no surface oxide thickening during cycling is observed in bright-field transmission electron microscopy. Both results are consistent with a surface degradation mechanism for polycrystalline silicon fatigue such as the reaction-layer mechanism. The improved frequency evolution has the potential of increasing the performance of resonator-based microelectromechanical system sensors.


Related Articles

  • Evidence for oxygen bubbles in subsurface Al2O3 layers formed in aluminum by oxygen implantation. Musket, R. G.; Brown, D. W.; Pinizzotto, R. F. // Applied Physics Letters;8/18/1986, Vol. 49 Issue 7, p379 

    In an earlier paper [R. G. Musket, D. W. Brown, and H. C. Hayden, Nucl. Instrum. Methods B 7/8, 31 (1985)] we showed that high-dose oxygen ion implantation into bulk aluminum results in the formation of subsurface layers of Al2O3. However, for oxygen doses exceeding that required for oxidation...

  • Corrosion of Aluminium in Chloride Environments. Oki, Makanjuola // International Research Journal of Pure & Applied Chemistry;Apr-Jun2013, Vol. 3 Issue 2, p147 

    In order to obtain further insights into the mode of protection afforded by conversion coatings on aluminium substrates, Scanning and Transmission Electron microscopy techniques and potential measurements was employed to monitor variously treated aluminium specimens in chloride environments....

  • Using Image Analysis for Structural and Mechanical Characterization of Nanoclay Reinforced Polypropylene Composites. Mohan, Turup Pandurangan; Kanny, Krishnan // Engineering;Oct2010, Vol. 2 Issue 10, p802 

    This paper focuses on the micromechanical study of the tensile property of Polymer-Clay Nanocomposites (PCN). Polypropylene (PP) filled with nanoclay is chosen as the PCN. Measurements of optical dispersion parameters (as discussed by Basu et al., namely, exfoliation number (δn), degree of...

  • In situ tensile testing of nanoscale freestanding thin films inside a transmission electron microscope. Haque, M. A.; Saif, M. T. A. // Journal of Materials Research;Jul2005, Vol. 20 Issue 7, p1769 

    The unique capability of rendering opaque specimens transparent with atomic resolution makes transmission electron microscopy (TEM) an indispensable tool for microstructural and crystallographic analysis of materials. Conventional TEM specimens are placed on grids about 3 mm in diameter and...

  • In situ transmission electron microscopy studies enabled by microelectromechanical system technology. Zhang, M.; Olson, E. A.; Twesten, R. D.; Wen, J. G.; Allen, L. H.; Robertson, I. M.; Petrov, I. // Journal of Materials Research;Jul2005, Vol. 20 Issue 7, p1802 

    We have designed and fabricated a standardized specimen holder that allows the operation of a microelectromechanical system (MEMS) device inside a transmission electron microscope (TEM). The details of the design and fabrication processes of the holder are presented. The sample loading mechanism...

  • The role of Ni buffer layer on high yield low temperature hermetic wafer bonding using In/Sn/Cu metallization. Yu, Da-Quan; Lee, Chengkuo; Yan, Li Ling; Choi, Won Kyoung; Yu, Aibin; Lau, John H. // Applied Physics Letters;1/19/2009, Vol. 94 Issue 3, pN.PAG 

    Low temperature hermetic wafer bonding using In/Sn interlayer and Au/Ni/Cu metallization as the high-melting-point (HMP) components was reported, wherein the thin Ni layer was introduced as a buffer layer to prevent solder consumption after their deposition. 8 in. wafer to wafer bonding was...

  • Atomic-scale imaging of individual dopant atoms in a buried interface. Shibata, N.; Findlay, S. D.; Azuma, S.; Mizoguchi, T.; Yamamoto, T.; Ikuhara, Y. // Nature Materials;Aug2009, Vol. 8 Issue 8, p654 

    Determining the atomic structure of internal interfaces in materials and devices is critical to understanding their functional properties. Interfacial doping is one promising technique for controlling interfacial properties at the atomic scale, but it is still a major challenge to directly...

  • Effects of Al[sub 2]O[sub 3] cap on the structural and electrical properties of Au/Te/Au.... Lin, X.W.; Piotrowska, A.; Kaminska, E.; Liliental-Weber, Z.; Washburn, J.; Weber, E. // Applied Physics Letters;6/7/1993, Vol. 62 Issue 23, p2995 

    Examines the effects of aluminum oxide cap on the structural and electrical properties of gold/tellurium/gold ohmic contacts. Growth of ohmic contacts on an n-type gallium arsenide substrate. Use of transmission electron microscopy and current-voltage measurements.

  • Material characteristics and capacitive properties of aluminum anodic oxides formed in various electrolytes. Jeng-Kuei Chang; Chi-Min Liao; Chih-Hsiung Chen; Wen-Ta Tsai // Journal of Materials Research;Nov2004, Vol. 19 Issue 11, p3364 

    The microstructure and composition of aluminum oxide films, formed by a two-step anodization process in various electrolytes at 100 V then subject to an intermediate heat treatment (500 °C, 2 min), were investigated. The anodizationanodization electrolytes used included ammonium adipate...


Read the Article


Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics