IBM, Applied, UAlbany team for 22-nm work to be validated on finFETs

Deffree, Suzanne
March 2009
Electronic News;3/2/2009, Vol. 55 Issue 9, p4
Trade Publication
The article reports on the plans of IBM Corp., Applied Materials Inc. and the College of Nanoscale Science and Engineering of the University of Albany, New York, to jointly develop process modeling technology for manufacturing 22-nm logic and memory chips. The project aims to minimize process variation, reduce development cost, and improve time to market for 22-nm semiconductors. Additional modeling and process characterization will be performed at IBM's facilities in East Fishkill, New York.


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