TITLE

Building Big Boards

AUTHOR(S)
Sprovieri, John
PUB. DATE
February 2009
SOURCE
Assembly;Feb2009, Vol. 52 Issue 2, p48
SOURCE TYPE
Periodical
DOC. TYPE
Article
ABSTRACT
The article focuses on the challenges in developing big printed circuit boards (PCB) in the assembly process. It states the challenge involved in applying solder paste to large PCBs. It emphasizes the need for special printers and custom frames in order to print across a large area. The author compares the efficiency of forced convection ovens with infrared models in heating large PCB.
ACCESSION #
36996637

 

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