Building Big Boards

Sprovieri, John
February 2009
Assembly;Feb2009, Vol. 52 Issue 2, p48
The article focuses on the challenges in developing big printed circuit boards (PCB) in the assembly process. It states the challenge involved in applying solder paste to large PCBs. It emphasizes the need for special printers and custom frames in order to print across a large area. The author compares the efficiency of forced convection ovens with infrared models in heating large PCB.


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