TITLE

NXP Uses Automation to Remain Competitive

PUB. DATE
January 2009
SOURCE
Assembly;Jan2009, Vol. 52 Issue 1, p38
SOURCE TYPE
Periodical
DOC. TYPE
Article
ABSTRACT
This article examines the cross-functional product development program and highly automated manufacturing processes used by NXP Semiconductors which are the main factors for its competitiveness. NXP produces nearly a third of all the mobile-phone loudspeakers used worldwide. Aside from lowering labor costs and improving quality, the automated processes of NXP allow it to ramp up assembly of new products much more quickly than is possible when employing hundreds of manual workers who must all be individually trained. INSET: Robots Improve Insert Molding Processes.
ACCESSION #
36159865

 

Related Articles

  • Follow the yellow brick road...map. Schweber // EDN;01/06/2000, Vol. 45 Issue 1, p39 

    Cautions electronics designers against believing claims by some semiconductor vendors about potential technology road maps. Problem of relying on the availability of a company's component for the completion of a new product; Difficulty of distinguishing the goal and reality in the process of...

  • AN EXTENDED TYPOLOGY OF STRATEGIC ORIENTATION AND ITS LINKAGES TO PRODUCT INNOVATIVENESS. Engelland, Brian T.; Summey, John H. // Journal of Marketing Management (10711988);Spring1999, Vol. 9 Issue 2, p19 

    Strategic orientation typologies serve to simplify competitive analysis, help distill strategic options and communicate how individual competitors compete. The authors develop an expanded typology of strategic orientation which includes the four Miles and Snow types (prospector, Defender,...

  • COMMENTARY. Pullin, John // Professional Engineering;1/26/2005, Vol. 18 Issue 2, p3 

    The article discusses the need for innovation in product development. It states that these days, it is possible but not yet commonplace to build in information about a product's manufacturability and about all manner of costs associated with production and logistics later down the line. One...

  • TSMC launches 65-, 40-nm SPICE tool qualification program. Mutschler, Ann Steffora // Electronic News;4/28/2008, Vol. 54 Issue 17, p8 

    The article announces that Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) detailed its SPICE tool qualification program. The program is targeted at TSMC's 65-nm and smaller process technologies and the company said specific benefits include improved device model accuracy, enhanced simulation...

  • America's edge in new product R&D. Souder, William E.; Song, X. Michael; Kawamura, Kazuhiko // Research Technology Management;Mar/Apr98, Vol. 41 Issue 2, p49 

    Focuses on the advantage held by corporations from the United States with their use of the controlled scrimping method in product research and development. Description of controlled scrimping; Percentage of products that succeeded when all three product development stages were thorough and when...

  • PROCESS INNOVATION--CASE STUDIES OF CRITICAL SUCCESS FACTORS. Bender, Kevin W.; Cedeno, Jose E. // Engineering Management Journal;Dec2000, Vol. 12 Issue 4, p17 

    Presents information on a study which determined the factors that are important to a service organization when innovating new processes. Methodology; Implications for process versus product innovations; Conclusions. INSET: Process readiness questionnaire..

  • How do Ideal with conflict with my CEO? Chang, Milton // Laser Focus World;Mar2008, Vol. 44 Issue 3, p57 

    The article provides an answer to a question on how to deal conflicts with the chief executive officer and the company's founder due to product development.

  • Literature review. Bradbury, Johanna L. // Modern Machine Shop;May98, Vol. 70 Issue 12, p206 

    Presents new products in 1998 for manufacturing processes. Drill-Mill from Kyocera Industrial Ceramics company; Mitutoyo CP-200 Digital Contracer from Mitutoyo Measuring Instruments company; Rapid Response Manufacturing Client/Server from ProfitKey International company.

  • The gleam of well-polished sapphire. HOWLAND, REBECCA; PIERSON, TOM // Solid State Technology;Jan2013, Vol. 56 Issue 1, p26 

    The article presents information on improving yield by light-emitting diode (LED) manufacturer. According to the author, contributing to the benefits of process control would be better yield and reliability, shorter manufacturing cycle time, and faster time to market for new products. It is...

Share

Read the Article

Courtesy of THE LIBRARY OF VIRGINIA

Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics