TITLE

Atomic-layer-deposited Al2O3/GaAs metal-oxide-semiconductor field-effect transistor on Si substrate using aspect ratio trapping technique

AUTHOR(S)
Wu, Y. Q.; Xu, M.; Ye, P. D.; Cheng, Z.; Li, J.; Park, J.-S.; Hydrick, J.; Bai, J.; Carroll, M.; Fiorenza, J. G.; Lochtefeld, A.
PUB. DATE
December 2008
SOURCE
Applied Physics Letters;12/15/2008, Vol. 93 Issue 24, p242106
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
High quality GaAs epilayers grown by metal-organic chemical vapor deposition are demonstrated on a SiO2-patterned silicon substrate using aspect ratio trapping technique, whereby threading dislocations from lattice mismatch are largely reduced via trapping in SiO2 trenches during growth. A depletion-mode metal-oxide-semiconductor field-effect transistor (MOSFET) is demonstrated on a n-doped GaAs channel with atomic-layer deposited Al2O3 as the gate oxide. The 10 μm gate length transistor has a maximum drain current of 88 mA/mm and a transconductance of 19 mS/mm. The surface mobility estimated from the accumulation drain current has a peak value of ∼500 cm2/Vs, which is comparable with those from previously reported depletion-mode GaAs MOSFETs epitaxially grown on semi-insulating GaAs substrates.
ACCESSION #
35922119

 

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