Vertical integration on plastic substrates using transfer printing

Tunnell, A. J.; Ballarotto, V. W.; Hines, D. R.; Williams, E. D.
November 2008
Applied Physics Letters;11/10/2008, Vol. 93 Issue 19, p193113
Academic Journal
A process for preparing vertical interconnects for flexible electronics using transfer printing is reported. The interconnects are initially prepared on a sacrificial transfer substrate in a four step process that yields a subassembly of upper electrode, interconnect, and dielectric. This subassembly is printed as a unit onto the lower electrodes. The average contact resistance is less than 1 Ω/25 μm2 interconnect cross section. The quality of the resulting conductive paths is established by fabricating and characterizing (to 5 GHz) the inductances and quality factors of a series of square planar spiral inductors.


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