Predicted thermally induced stresses in, and the bow of, a circular substrate/thin-film structure

Suhir[a], E.
September 2000
Journal of Applied Physics;9/1/2000, Vol. 88 Issue 5, p2363
Academic Journal
Describes the development of a simple analytical stress model for the evaluation of the thermally induced stresses in, and the bow of, a circular substrate/thinfilm structure. Ability to predict and minimize the thermally induced stresses and deflections in such a structure; Consequence of the dissimilar materials in the structure.


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