TITLE

"POP" Goes the Future

AUTHOR(S)
Sprovieri, John
PUB. DATE
October 2008
SOURCE
Assembly;Oct2008, Vol. 51 Issue 11, p42
SOURCE TYPE
Periodical
DOC. TYPE
Article
ABSTRACT
The article offers information on package-on-package (POP) assembly which can help electronic manufacturers cram more functions into smaller devices. The entry describes a POP assembly as two or more fine-pitch ball grid arrays (BGA) that are stacked on top of each other. In relation to this, a POP assembly is produced using the standard surface-mount process with the BGA fed from tape or trays. Also reported is Henkel's introduction of an epoxy molding compound that minimizes warping of POP assembly.
ACCESSION #
34923900

 

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