TITLE

Local droplet etching of nanoholes and rings on GaAs and AlGaAs surfaces

AUTHOR(S)
Stemmann, A.; Heyn, Ch.; K�ppen, T.; Kipp, T.; Hansen, W.
PUB. DATE
September 2008
SOURCE
Applied Physics Letters;9/22/2008, Vol. 93 Issue 12, p123108
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
We study the formation of nanoholes and rings on GaAs and AlGaAs surfaces by local droplet etching (LDE) with gallium and indium. The nanohole properties are tuned by variation in etching temperature and time as well as by the etchant. Nanoholes fabricated by In LDE are larger and have an about ten times lower density compared to Ga LDE, which allows the fabrication of nanoholes with ultralow density of less than 5�106 cm-2. Furthermore, the nanohole borders are surrounded by distinct walls. The walls are crystallized from droplet material and serve as quantum rings with tunable size and band gap.
ACCESSION #
34647405

Tags: ETCHING;  GALLIUM;  INDIUM;  TEMPERATURE;  ETCHING reagents

 

Related Articles

  • Significant increase of light emission efficiency by in situ site-selective etching of InGaN quantum wells. Fang, Zhilai // Journal of Applied Physics;Jul2009, Vol. 106 Issue 2, p023517-1 

    An indium post-treatment of the InGaN epilayers was employed for InGaN-to-GaN interface modification. We find that the treatment could lead to selective etching of the InGaN epilayers around threading dislocations (TDs) due to preferential etching of the chemically active step-correlated TDs and...

  • Molecular layer etching of GaAs. Aoyagi, Yoshinobu; Shinmura, Kohji // Applied Physics Letters;2/24/1992, Vol. 60 Issue 8, p968 

    Examines the molecular layer self-limiting etching of gallium arsenide (GaAs). Employment of chlorine etchant alternative feeding and low energy argon ion beam to the GaAs substrate; Analysis on the saturation of the etching rate; Independence of etching rate from etchant feeding rate and...

  • High-power buried heterostructure InGaAsP/InP laser diodes produced by an improved regrowth process. Garbuzov, D. Z.; Berishev, I. E.; Ilyin, Yu. V.; Ilyinskaya, N. D.; Ovchinnikov, A. V.; Pikhtin, N. A.; Tarasov, I. S. // Journal of Applied Physics;7/1/92, Vol. 72 Issue 1, p319 

    Describes the preparation and performance of single lateral mode buried heterostucture indium-gallium-arsenic-phosphorus/indium-phosphorus laser diodes. Maximum continuous wave power in single lateral mode operation; Use of various wet chemical etchants; Efficiency of etching with an...

  • Applied unveils remote plasma etcher system.  // Electronic News (10616624);7/10/95, Vol. 41 Issue 2073, p102 

    Comments on Applied Materials' introduction of an etch system with what it called the remote plasma source (RPS) for solving problems associated with wet etch systems used for many isotropic etch procedures. Its suitability for devices with 0.5 micron features and below; How it extends...

  • Shape transformation of nanoporous GaN by annealing: From buried cavities to nanomembranes. Yerino, Christopher D.; Yu Zhang; Leung, Benjamin; Lee, Minjoo L.; Ta-Cheng Hsu; Chun-Kai Wang; Wei-Chih Peng; Han, J. // Applied Physics Letters;6/20/2011, Vol. 98 Issue 25, p251910 

    Gallium nitride is considered a chemically inert, ceramic-like semiconductor with no effective etchants available at room temperature. In this letter, we study the shape transformation of nanoporous GaN prepared by an electrochemical process. It is found that the curvature-driven mass transport...

  • Catalyzed gaseous etching of silicon. Selamoglu, Nur; Mucha, John A.; Flamm, Daniel L.; Ibbotson, Dale E. // Journal of Applied Physics;8/1/87, Vol. 62 Issue 3, p1049 

    Presents the traces of copper and silver to accelerate the etching of silicon by molecular fluorine. Examples of enhancement of silicon etching; Arrhenius plot of silicon etch rate with and without copper present; Effect of etchant gas and metal contaminant on silicon etching.

  • Formation of optoelectronic structures based on InAsSb/InAsSbP solid solutions. Grebenshchikova, E. A.; Litvak, A. M.; Sherstnev, V. V.; Yakovlev, Yu. P. // Technical Physics Letters;Aug98, Vol. 24 Issue 8, p593 

    An etchant having the composition HCl/CrO[sub 3]/HF/H[sub 2]O is proposed for fabricating optoelectronic devices (lasers, light-emitting diodes, and photodiodes) based on InAs solid solutions for the 3 - 5 �m spectral range. It is shown that the proposed etchant ensures isotropic rates of...

  • Mass spectrometric transient study of dc plasma etching of Si in CF4 and CF4/O2 mixtures. Brandt, W. W.; Honda, T. // Journal of Applied Physics;1/1/85, Vol. 57 Issue 1, p119 

    Carries out the direct current plasma experiments on polycrystalline silicon wafers using californium (CF)[sub4] and CF[sub4]/oxygen mixtures as etchants. Rate of oxygen absorption; Effect on the etching rate when oxygen pulses are injected simultaneously with CF[sub4] pulses; Removal of oxide...

  • Improved aqueous etchant for high T[sub c] superconductor materials. Ashby, Carol I.H.; Martens, Jon // Applied Physics Letters;4/27/1992, Vol. 60 Issue 17, p2147 

    Develops an aqueous etchant for high temperature superconductor materials. Factors responsible for the increase in surface resistance; Cause of the reduction of surface-resistance degradation; Selection of etching times for surface resistant measurements.

Share

Read the Article

Courtesy of your local library

Public Libraries Near You (See All)
Looking for a Different Library?

Other Topics