TITLE

High Thermal Efficiency Modeling Technique for High Power LED Packages

AUTHOR(S)
Siang Ling Oon
PUB. DATE
September 2008
SOURCE
LED Journal;Sep/Oct2008, Vol. 3 Issue 5, p16
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
The article focuses on the development of a high-power light emitting diode (LED) star package assembly with a heat sink that is capable of maintaining the junction temperature of a nominal one-watt LED light source that operates at 3.5 volts (V) and 350 milliamperes (mA) to the maximum value of 125° Celsius. The detailed model of an LED package mounted on a star substrate is modified to show a heat sink on the bottom of the LED star package assembly.
ACCESSION #
34073624

 

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