TITLE

Infineon, STATS ChipPAC, STMicroelectronics to develop wafer-level-packaging standard

AUTHOR(S)
Mutschler, Ann Steffora
PUB. DATE
August 2008
SOURCE
Electronic News;8/11/2008, Vol. 54 Issue 32, p16
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
The article reports that Infineon Technologies AG, STATS ChipPAC Ltd. and STMicroelectronics NV have agreed to jointly develop the embedded Wafer-Level Ball Grid Array (eWLB) technology, based on Infineon's first-generation technology. It states that Infineon's embedded wafer-level ball grid array technology uses a combination of traditional front-end and back-end semiconductor manufacturing techniques with parallel processing of all the chips on the wafer, meant to reduce manufacturing costs.
ACCESSION #
34047048

 

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