Infineon, STATS ChipPAC, STMicroelectronics to develop wafer-level-packaging standard

Mutschler, Ann Steffora
August 2008
Electronic News;8/11/2008, Vol. 54 Issue 32, p16
Trade Publication
The article reports that Infineon Technologies AG, STATS ChipPAC Ltd. and STMicroelectronics NV have agreed to jointly develop the embedded Wafer-Level Ball Grid Array (eWLB) technology, based on Infineon's first-generation technology. It states that Infineon's embedded wafer-level ball grid array technology uses a combination of traditional front-end and back-end semiconductor manufacturing techniques with parallel processing of all the chips on the wafer, meant to reduce manufacturing costs.


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