Extending lithography to the wafer's edge

Tuan Le; Wilson, Matt; Maas, Raymond
August 2008
Microlithography World;Aug2008, Vol. 17 Issue 3, p7
Trade Publication
The article focuses on the development of back rinse processes for edge bead removal (EBR) by manufacturers which allows them to extend lithography films into the upper bevel at the wafer edge. The vulnerability of the film to the forces exerted by the fluid used in immersion lithography is reduced by positioning the film edges on the bevel. ASML and Rudolph Technologies are collaborating with device manufacturers to develop back rinse EBR processes. It cites the importance of careful monitoring to the process.


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