TITLE

IBM, Toppan expand photomask development to include 22-nm node

AUTHOR(S)
Mutschler, Ann Steffora
PUB. DATE
June 2008
SOURCE
Electronic News;6/23/2008, Vol. 54 Issue 25, p16
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
The article reports on the agreement made by International Business Machine Corp. and Toppan Printing Co. Ltd. in expanding the photomask process development in the U.S. The development deal encompasses the last phase of 32-nm photomask manufacturing procedure development to be done at IBM's Burlington photomask facility in Essex Junction, VT. It states that the working process is essential to the growth of lithography technologies that will be in demand to make future-generation semiconductors.
ACCESSION #
32956366

 

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