TITLE

Solving the gate ACLV and ADLV challenges with printing assist features

AUTHOR(S)
Haffner, Henning; Meiring, Jason; Baum, Zachary; Halle, Scott; Mansfield, Scott
PUB. DATE
May 2008
SOURCE
Microlithography World;May2008, Vol. 17 Issue 2, p7
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
The article discusses ways to enhance across-chip and across-device linewidth variation (ACLV and ADLV) against single exposure processes. It is stated that double patterning is widely employed for printing the 32nm half-pitch node using water immersion lithography. One reason is that it allows successful k1 factors below 0.25. On the other hand, double patterning also bears the likelihood of notably enhancing processes with greater k1 factors.
ACCESSION #
32061495

 

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