Khan, Zulki
May 2008
Printed Circuit Design & Manufacture;May2008, Vol. 25 Issue 5, p40
Trade Publication
The article focuses on the need for process-related issues to be specified in the assembly drawing to eliminate board defects. Defects of printed circuit board (PCB) may cause deteriorated radio-frequency (RF) signals resulting from inappropriate shielding, incorrectly structured boards due to sketchy or ambiguous fabrication notes and miscalculated thermal profiles. Areas within an RF design in which defects may result include improperly designed antenna, signal deterioration at an unacceptable rate and lack of attention to line-of-sight aspects.


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