TITLE

Eliminating BOARD DEFECTS

AUTHOR(S)
Khan, Zulki
PUB. DATE
May 2008
SOURCE
Printed Circuit Design & Manufacture;May2008, Vol. 25 Issue 5, p40
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
The article focuses on the need for process-related issues to be specified in the assembly drawing to eliminate board defects. Defects of printed circuit board (PCB) may cause deteriorated radio-frequency (RF) signals resulting from inappropriate shielding, incorrectly structured boards due to sketchy or ambiguous fabrication notes and miscalculated thermal profiles. Areas within an RF design in which defects may result include improperly designed antenna, signal deterioration at an unacceptable rate and lack of attention to line-of-sight aspects.
ACCESSION #
31979110

 

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