TITLE

3DASSM Consortium Hosts Industry/Academia Workshop

PUB. DATE
March 2008
SOURCE
Advanced Packaging;Mar2008, Vol. 17 Issue 2, p10
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
The article reports on the series of industry/academia workshops for the launch of the 3D All Silicon System Module (3DASSM) Consortium in Georgia Institute of Technology in Atlanta on March 11-12, 2008. The consortium, created by the Packaging Resource Center at Georgia Institute of Technology, Fraunhofer and Korea Advanced Institute of Science Technology (KAIST), aims the partnership between global companies in Europe, Asia and the U.S.
ACCESSION #
31203462

 

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