New thermoelectric material

April 2000
Science Teacher;Apr2000, Vol. 67 Issue 4, p16
Academic Journal
Reports on the discovery of a thermoelectric material, which is a combination of cesium, bismuth and tellurium, which can possibly double the speed at which computers operate. Application in cooling of computer chips.


Related Articles

  • Computers hot up with cooler chips. Geake, Elisabeth // New Scientist;6/29/91, Vol. 130 Issue 1775, p29 

    Reports on the launch of chip fridges which supposedly increases the computation speed of computers by California computer companies Cambion IPI and Velox. Names of the cooling elements launched by the two companies; Explanation for the Peltier effect; Comment of Cambion Great Britain office...

  • A Study on Control of Heat Generation in Computer using Thermoelectric Cooling System. Yool-Kwon Oh; Ho-Dong Yang // Journal of the Korea Academia-Industrial Cooperation Society;2015, Vol. 16 Issue 1, p43 

    In recent years, the amount of heat generated inside of the computer has more increased because of high performance, multi-function, miniaturization and light weight. It is necessary to control the effective heat generation to improve performance and life extension of the computer. In this...

  • Thermoelectric properties of Tl[sub 2]SnTe[sub 5] and Tl[sub 2]GeTe[sub 5]. Sharp, Jeff W.; Sales, Brian C. // Applied Physics Letters;6/21/1999, Vol. 74 Issue 25, p3794 

    Reports on the thermoelectric properties of two ternary tellurides with known crystal structures. Low lattice thermal conductivity of Tl[sub 2]SnTe[sub 5] and Bi[sub 2]Te[sub 3]; P-type figure of merit; Use of the thermoelectric effect for a wide variety of small-scale cooling applications.

  • Cold and calculated. Firth, Niall // Engineer (00137758);1/29/2007, Vol. 293 Issue 7716, p12 

    The article reports on the establishment of a government-fund project in Great Britain which will develop a miniature refrigerator to be installed inside personal computers to keep electronic chips cool. The research team plans to design a low-cost micro-refrigerator that will be small enough to...

  • Untitled. Mohamed, Arif // Computer Weekly;2/16/2010, p8 

    The article reports that the latest datacentre model of International Business Machines Corp. (IBM) is based on water cooling particularly at chip level. IBM research project utilizes a high-performance liquid cooling to conduit water at high speeds through tiny copper pipes above the...

  • Consortium aims at breakthroughs in chip cooling. Sewell, Kelly // Military & Aerospace Electronics;Apr95, Vol. 6 Issue 4, p25 

    Reports on the cooperation between thee companies in the United States for the development of low-cost methods of manufacturing diamond film. Diamond film for cooling computer chips and laser circuits; Interest of the US Advanced Research Project Agency; Potential uses of the technology.

  • Microjets offer on-the-spot chip cooling. Schofield, Julie Anne // Design News;11/18/96, Vol. 52 Issue 23, p11 

    Announces Georgia Tech Packaging Research Center's new microjets for on-the-spot chip cooling. Capabilities.

  • Stick-on bandage spreads chip heat. Schofield, Julie Anne // Design News;5/20/96, Vol. 52 Issue 10, p77 

    Reports on a simple way to cool integrated circuits (ICs) for less than a dollar with the result being reduced package temperatures by up to 25C. Difference in conventional heat sinks and the T-WINGS; Provision of a strong bond at temperatures as high as 125C.

  • Influence of Geometrical Factors on Performance of Thermoelectric Material Using Numerical Methods. Derebasi, Naim; Eltez, Muhammed; Guldiken, Fikret; Sever, Aziz; Kallis, Klaus; Kilic, Halil // Journal of Electronic Materials;Jun2015, Vol. 44 Issue 6, p2068 

    Prediction of the performance of thermoelectric cooling material (figure of merit, ZT) was carried out by simulated results obtained from the finite element method (FEM) as a training dataset with an artificial neural network. A total of 87 input vectors for the ZT obtained from the four...


Read the Article


Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics