TITLE

Engineering MICROSCOPES ZOOM IN ON DEFECTS

AUTHOR(S)
Mendelsohn, Alex
PUB. DATE
December 2007
SOURCE
Test & Measurement World;Dec2007/Jan2008, Vol. 27 Issue 11, p43
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
The article discusses the effect of microscopy systems on the way engineers develop and test semiconductors and materials, as well as technologies like microelectromechanical systems (MEMS). Terrence Lundy, vice president and managing director at Hyphenated Systems, stresses that the combination of 3-D with metrology allows them to look at, and measure the dimensions of semiconductor features including trenches and through-silicon vias (TSV). Information about TSV is discussed.
ACCESSION #
28132124

 

Related Articles

  • MEMS Packaging Update. Gilleo, Ken // Advanced Packaging;Sep2005, Vol. 14 Issue 9, p20 

    Provides an overview on the advancements in microelectromechanical systems (MEMS) packaging. Popularity of motion sensors; Advantages of ink-jet chips; Applications for inertial sensors; Surface machining process.

  • MEMS And Nano Push For Higher System Integration Levels. Allan, Roger // Electronic Design;1/14/2010, Vol. 58 Issue 1, p73 

    The article discusses the move of the microelectromechanical systems (MEMS) industry to integrate with higher systems particularly the use of nano-sized devices in the U.S. It explores the significance and benefits of the industry's coordination with nano devices to enable and extend MEMS' usage...

  • MEMS-DESIGN SOFTWARE PROVIDES EDA APPROACH. Moretti, Gabe // EDN;7/8/2004, Vol. 49 Issue 14, p20 

    The article deals with the release of the CoventorWare suite by Coventor, a provider of tools for the development of microelectromechanical systems (MEMS), microfluidics and semiconductor process applications. The tools allow developers to combine MEMS models with electronic models they...

  • Standard Open Tool Packages for MEMS-enabled Products. Da Silva, Mark // Advanced Packaging;Sep2004, Vol. 13 Issue 9, p26 

    Discusses standard open tool packages for microelectromechanical system (MEMS) devices. Packaging costs of MEMS devices; Difference between packaging MEMS components from microelectronics; MEMS packaging complexity; Packaging during the design phase.

  • World's Smallest Universal Material Testing System. Geiger, Greg // American Ceramic Society Bulletin;Nov2005, Vol. 84 Issue 11, p4 

    The article reports that researchers at Northwestern University in Evanston, Illinois have designed and built a complete micromachine that makes possible the study of nanomechanics phenomena in real time. The machine has the ability to fit into tiny spaces as required by in-situ transmission...

  • MEMS Technology Moves Into More Applications. Allan, Roger // Electronic Design;2/18/2002, Vol. 50 Issue 4, p27 

    Reports on the increasing applications of microelectromechanical system technology. Integration of large analog devices with front-end and back-end digital circuitry.

  • MEMS Growth Reflected In Space Instrumentation. Marshall, Sid // R&D Magazine;Jul99, Vol. 41 Issue 8, p37 

    Discusses the applications of microelectromechanical systems and microsystems technology. Presentations at the conference on Micronanotechnology for Space Applications in 1999; Discussion on space instrumentation; Examples of space instrumentation.

  • Industry Roadmap Planned For Microsystems Technology. Marshall, Sid // R&D Magazine;Jul99, Vol. 41 Issue 8, p44 

    Discusses information on microsystems technology (MST). Need for increased functionality and other improvements in technology systems; Status of MST markets worldwide; Application of MST.

  • Defined film thickness leads to more MEMS on SOI. Celler, George K. // Solid State Technology;Dec2003, Vol. 46 Issue 12, p51 

    Features microelectromechanical systems, also commonly referred to in Europe as microsystem technologies, that are currently undergoing what can only be termed as a revolution. Important components that help drive this new wave; Impact of the growing shift from bulk silicon wafers to...

Share

Read the Article

Courtesy of NEW JERSEY STATE LIBRARY

Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics