TITLE

Engineering MICROSCOPES ZOOM IN ON DEFECTS

AUTHOR(S)

Mendelsohn, Alex

PUB. DATE

December 2007

SOURCE

Test & Measurement World;Dec2007/Jan2008, Vol. 27 Issue 11, p43

SOURCE TYPE

Trade Publication

DOC. TYPE

Article

ABSTRACT

The article discusses the effect of microscopy systems on the way engineers develop and test semiconductors and materials, as well as technologies like microelectromechanical systems (MEMS). Terrence Lundy, vice president and managing director at Hyphenated Systems, stresses that the combination of 3-D with metrology allows them to look at, and measure the dimensions of semiconductor features including trenches and through-silicon vias (TSV). Information about TSV is discussed.

ACCESSION #

28132124

 

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