Mendelsohn, Alex
December 2007
Test & Measurement World;Dec2007/Jan2008, Vol. 27 Issue 11, p43
Trade Publication
The article discusses the effect of microscopy systems on the way engineers develop and test semiconductors and materials, as well as technologies like microelectromechanical systems (MEMS). Terrence Lundy, vice president and managing director at Hyphenated Systems, stresses that the combination of 3-D with metrology allows them to look at, and measure the dimensions of semiconductor features including trenches and through-silicon vias (TSV). Information about TSV is discussed.


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