TITLE

ASE to leverage SUSS MicroTec's litho equipment in wafer level packaging ops

AUTHOR(S)
Mutschler, Ann Steffora
PUB. DATE
November 2007
SOURCE
Electronic News;11/26/2007, Vol. 53 Issue 48, p24
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
The article reveals the plan of ASE Group to use lithography production equipment from SUSS MicroTec in its move towards more sophisticated semiconductor applications. The equipment is to be installed at ASE's wafer level packaging and redistribution process facility in Kaohsiung, Taiwan. The companies reminded that wafer level packaging is an advanced packaging technology whereby the die and package are manufactured and tested on the wafer, then diced into individually packaged integrated circuits.
ACCESSION #
27740407

 

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