Ericsson and Texas Instruments to Co-Develop 3G Solutions for Handset Manufacturers

August 2007
Portable Design;Aug2007, Vol. 13 Issue 8, p12
The article reports on the initiative of Ericsson Inc. and Texas Instruments Inc. to form a strategic technology engagement for the development of custom solutions for new Open OS-enabled 3G devices in the U.S. The solutions created by the two firms will combine third-generation (3D) modems from Ericsson Mobile Platforms with Open Multimedia Applications Platform (OMAP) applications processors from Texas Instruments. The availability of the handsets based on the created solution on the market will be on the second half of the year 2008.


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