TITLE

What to Look for When Qualifying a New Process (Part I)

AUTHOR(S)
Munson, Terry
PUB. DATE
September 2007
SOURCE
Circuits Assembly;Sep2007, Vol. 18 Issue 9, p52
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
The article presents a study which aimed to qualify the primary and secondary soldering operations processes. According to the article, the Umpire Test assembly is used to observe the interactions of top- and bottom-side surface mount technology, wave solder, selective solder, hand solder and repair. The article says that residue impact, solder mask porosity and soldering residue effects aside from the bare board cleanliness have to be evaluated. It also offers information on a process qualification done on an internal mixed-technology assembly.
ACCESSION #
26510753

 

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