TITLE

Topcoat-free photoresists for 193nm immersion lithography

AUTHOR(S)
Sanders, Daniel P.; Sundberg, Linda K.; Sooriyakumaran, Ratnam; Allen, Robert D.
PUB. DATE
August 2007
SOURCE
Microlithography World;Aug2007, Vol. 16 Issue 3, p8
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
The article details how to develop additive-based topcoat-free photoresists for 193nm immersion lithography. It notes that achieving the delicate balance between the hydrophobicity required for high water contact angles and the acidity required for topcoat removal in aqueous base developer has been critical to the success of commercial topcoat materials. Fluoroalcohol-based materials may continue to impact the extension of 193nm lithography as additives for topcoat-free photoresists.
ACCESSION #
26363562

 

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