Topcoat-free photoresists for 193nm immersion lithography

Sanders, Daniel P.; Sundberg, Linda K.; Sooriyakumaran, Ratnam; Allen, Robert D.
August 2007
Microlithography World;Aug2007, Vol. 16 Issue 3, p8
Trade Publication
The article details how to develop additive-based topcoat-free photoresists for 193nm immersion lithography. It notes that achieving the delicate balance between the hydrophobicity required for high water contact angles and the acidity required for topcoat removal in aqueous base developer has been critical to the success of commercial topcoat materials. Fluoroalcohol-based materials may continue to impact the extension of 193nm lithography as additives for topcoat-free photoresists.


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