TITLE

Handsets Shrink With Ceramic Circuits

AUTHOR(S)
Lopez, Ed
PUB. DATE
December 1999
SOURCE
Wireless Week;12/06/99, Vol. 5 Issue 49, p22
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Focuses on ceramic circuits being provided by a group of companies called Ceramic Interconnect Initiative. Trends in wireless devices; Use of ceramic-based materials in wireless components; Advantages of using ceramics in circuit making.
ACCESSION #
2594586

 

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