Japan drops 65nm fab plan but aims for 45nm standard

Manners, David
July 2006
Electronics Weekly;7/5/2006, Issue 2248, p14
Trade Publication
The article reports that after a government-backed plan to build a joint 65nm wafer fab was dropped, the industry appears to be putting in place the pre-requisites for a joint 45nm fab in Japan. The project has been dropped but, in its report, the planning firm Advanced Process Semiconductor Foundry Planning recommended that the industry standardize its process and design rules at 45nm. Fujitsu Ltd., Renesas, NEC and Toshiba Corp. plan to define a standard process technology for 45nm.


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