TITLE

C-MAC refocuses on chip packages

AUTHOR(S)
Wilson, Richard
PUB. DATE
July 2006
SOURCE
Electronics Weekly;7/5/2006, Issue 2248, p2
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
The article reports that the company C-MAC is to start offering multi-chip package assembly services to semiconductor firms as part of a reorganization of its hybrid manufacturing business. The Buckingham-based manufacturer is already assembling and testing a multi-chip module for Analog Devices and, according to C-MAC's chief executive officer (CEO) Indro Mukerjee, there are plans to expand this business.
ACCESSION #
25926016

 

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