Photovoltaic manufacturers embrace some laser use, but balkat laser marking

Blokken, Eddy
July 2007
Laser Focus World;Jul2007, Vol. 43 Issue 7, p64
The author reflects on the indifference of photovoltaic manufacturers on the use of laser marking to put a unique identification on each processed wafer. He argues that the photovoltaic industry will have no choice but to eventually adopt laser as complexities in the manufacturing process will continue to advance. Moreover, he stresses that the advancement in manufacturing processes will lead to the use of laser marking to provide the need for traceability.


Related Articles

  • Die Attach Goes Mainstream. Ashmore, Clive // Circuits Assembly;Sep2006, Vol. 17 Issue 9, p32 

    The article suggests a mass imaging or printing platform for die attach material deposition in semiconductor processing. The use of the conventional dispensing system to apply die attach adhesive pastes present a challenge as semiconductor manufacturers move to higher volume requirements and...

  • Improving 300mm wafer yield using x-ray diffraction inspection. Feichtinger, Petra // Solid State Technology;Apr2006, Vol. 49 Issue 4, p36 

    The article discusses issues related to improving 300-millimeter wafer yield using x-ray diffraction inspection. Digital x-ray diffraction inspection of 300-millimeter semiconductor wafers is challenging conventional semiconductor wafer inspection systems. Digital x-ray imaging for...

  • The essentials of single-wafer wet processing: selectivity and partnering. Archer, Leo // Solid State Technology;Apr2006, Vol. 49 Issue 4, p64 

    The article the essential factors in single-wafer wet processing. Selectivity and partnering are two of the most important factors in the implementation of future chemistry in single-wafer tools processing. The author believes that the development of a new selective cleaning process will require...

  • Improving particle contamination control with in-tool air ionization. Levit, Larry; Steinman, Arnold; Avery, Cheryl // Solid State Technology;Mar2007, Vol. 50 Issue 3, p48 

    The article presents a study which examines the impact of air ionization on the improvement of particle contamination control in process tools and wafers. The study utilizes particles per wafer pass (PWP) data both with and without air ionization to determine whether significant reductions in...

  • Wafer Processing with Short-pulsed UV DPSS Lasers. Mendes, Marco; Jognkook Park // Advanced Packaging;Mar2006, Vol. 15 Issue 3, p37 

    The article reports that developments in short-pulse-width, short-wavelength, diode-pumped solid-state (DPSS) lasers have resulted in robust, production-capable semiconductor wafer processing systems. These systems provide a broad range of flexibility for changing pulse shape, repetition rate...

  • July chip sales grow as 300mm crossover continues. Deffree, Suzanne // Electronic News;9/8/2008, Vol. 54 Issue 36, p3 

    The article reports on the increased sales of semiconductors in the U.S. for the second quarter of 2008. As semiconductor sales grow 2.8% month over month to $22.2 billion on consumer electronics, personal computers, and cell phones, overall capacity utilization remains high at 89%. According to...

  • Wafer-Level Failure Analysis Process Flow. Jeng-Han Lee; Yung-Sheng Huang; Su, David H. // Electronic Device Failure Analysis;May2010, Vol. 12 Issue 2, p4 

    The article provides information on the process flow of wafer-level failure analysis (FA), an integral part of the operation of a wafer fabrication facility in Taiwan. It states that the process flow requires an exercise of good professional judgment of the engineer to identify the root cause of...

  • Silicon Based Photovoltaic Cells For Concentration-Research And Development Progress In Laser Grooved Buried Contact Cell Technology. Cole, A.; Baistow, I.; Brown, L.; Devenport, S.; Drew, K.; Heasman, K. C.; Morrison, D.; Bruton, T. M.; Serenelli, L.; De Iuliis, S.; Izzi, M.; Tucci, M.; Salza, E.; Pirozzi, L. // AIP Conference Proceedings;12/2/2011, Vol. 1407 Issue 1, p46 

    The Laser grooved buried contact silicon solar cell (LGBC) process employed by Narec currently produces LGBC cells designed to operate at concentrations ranging from 1-100 suns and has demonstrated efficiencies at 50X of over 19% and at 100X of over 18.2% using 300 μm CZ silicon[1] wafers. As...

  • Automatic detection of micro-crack in solar wafers and cells: a review. Israil, Mohd; Anwar, Said Amirul; Abdullah, Mohd Zaid // Transactions of the Institute of Measurement & Control;Jul2013, Vol. 35 Issue 5, p606 

    This paper presents a review of the machine detection systems for micro-crack inspection of solar wafers and cells. To-date, there are various methods and procedures that have been developed at various laboratories around the world to inspect solar wafers and solar cells for manufacturing...


Read the Article


Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics