ARROW principle enables atomic spectroscopy on a chip

July 2007
Laser Focus World;Jul2007, Vol. 43 Issue 7, p13
The article reports on the success of atomic spectroscopy with integrated optics on a chip for the first time according to researchers at the University of California, Santa Cruz and Brigham Young University in the U.S. It guides a beam of light through a rubidium-vapor cell integrated into a semiconductor chip. Frequency stabilization for lasers, gas-detection sensors and quantum information processing are some of the potential applications.


Related Articles

  • Atomic spectroscopy: Rubidium on a chip. Sharping, Jay E. // Nature Photonics;Jun2007, Vol. 1 Issue 6, p315 

    The article comments on the report of Wenge Yang and colleagues about the fingertip-sized optical rubidium vapor cell which uses a hollow-core antiresonant reflecting optical waveguides on a silicon chip. The author said that Yang and colleagues demonstrated the saturation absorption...

  • Atomic spectroscopy on a chip. Wenge Yang; Conkey, Donald B.; Bin Wu; Dongliang Yin; Hawkins, Aaron R.; Schmidt, Holger // Nature Photonics;Jun2007, Vol. 1 Issue 6, p331 

    Guiding light through hollow optical waveguides has opened the field of photonics to the investigation of non-solid materials that have all the convenience of integrated optics. Of particular interest is the confinement of atomic vapours, such as rubidium, because of its wide range of...

  • Optical integrated circuits benefit from quantum-well intermixing. Jones-Bey, Hassaun A. // Laser Focus World;Jan2002, Vol. 38 Issue 1, p117 

    Reports that quantum-well intermixing (QWI) is one possible method under investigation for actually fabricating optical integrated circuits. First product from Intense Photonics using QWI; Comments from Erik Skogun of the University of California-Santa Barbara about the method of fabricating...

  • DFM-tool start-up claims big power and yield gains. Santarini, Michael // EDN;6/8/2006, Vol. 51 Issue 12, p36 

    The article provides information on Blaze Mo, a tool which can reduce transistor leakage power, leakage variability and improve timing without the need for changing the layouts of 90- and 65-nm integrated circuit designs, as claimed by its manufacturer BlazeDFM. Blaze Mo runs concurrently with...

  • A comparative study of GaSb (100) surface passivation by aqueous and nonaqueous solutions. Liu, Z.Y.; Kuech, T.F.; Saulys, D.A. // Applied Physics Letters;9/29/2003, Vol. 83 Issue 13, p2587 

    We report a nonaqueous passivation regime consisting of Na[sub 2]S/benzene/15-crown-5/oxidant. The use of a nonpolar, aprotic organic medium required the addition of a specific chelating agent (15-crown-5) to solubilize sodium sulfide, and organic oxidizing agents (anthraquinone, benzophenone,...

  • Chip CHALLENGES. Bartholomew, Doug // Industry Week/IW;09/18/2000, Vol. 249 Issue 15, p33 

    Focuses on the implementation of multiple process and material enhancement in making semiconductors. Advantages of copper interconnects; Information on the technique of IBM for building chips with low-capacitance dielectric; Advantage of 300-mm wafer format; Implications of the industry's move...

  • A close look at the Bluetooth market. Sabharwal, Navin // Solid State Technology;Dec2002, Vol. 45 Issue 12, p36 

    Presents an overview of the market for Bluetooth chips for the year 2002. Silicon chips; Chipset pricing; Chipset shipments; Semiconductor devices.

  • Teamwork: The key to success in flip chip design. Phipps, Gregory // Solid State Technology;Dec2002, Vol. 45 Issue 12, pS4 

    Highlights the importance of teamwork for success in flip chip design. Performance requirements of flip chip designs; Wire bond design process; Chip manufacturing processes; Design rules and processes.

  • Stresses and opportunity behind today's advanced-IC package proliferation.  // Solid State Technology;Mar2003, Vol. 46 Issue 3, p36 

    Focuses on the integrated circuit package proliferation in the semiconductor industry. Combination of design complexity and costs; Response to the customer demand; Need for comprehensive applications engineering.


Read the Article


Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics