TITLE

IBM touts chips made with self-assembly nanotechnology

AUTHOR(S)
Taylor, Colleen
PUB. DATE
May 2007
SOURCE
Electronic News;5/14/2007, Vol. 53 Issue 20, p3
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
The article focuses on the Airgap microprocessor unveiled by International Business Machine (IBM) which has been applied with success to conventional chip manufacturing. The technique causes a vacuum, or airgap, to form between the copper wires on a computer chip, allowing electrical signals to flow faster, while consuming less electrical power. According to IBM, the new technology can be incorporated into any standard complementary metal oxide semiconductor (CMOS) manufacturing line.
ACCESSION #
25158555

 

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