TITLE

Fiber lasers expand the application arena

PUB. DATE
May 2007
SOURCE
Industrial Laser Solutions;May2007, Vol. 22 Issue 5, p8
SOURCE TYPE
Periodical
DOC. TYPE
Article
ABSTRACT
The article focuses on the technologies used for cutting silicon. Near-infrared ND-YAG lasers have been widely used for soft and hard marking and cutting of silicon. A novel process called stealth dicing is being developed but poor flexibility similar to that in the glass cutting or cleaving process using carbon dioxide lasers is expected. On the other hand, the three common problems associated with laser cutting are also discussed.
ACCESSION #
25094240

 

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