Fiber lasers expand the application arena

May 2007
Industrial Laser Solutions;May2007, Vol. 22 Issue 5, p8
The article focuses on the technologies used for cutting silicon. Near-infrared ND-YAG lasers have been widely used for soft and hard marking and cutting of silicon. A novel process called stealth dicing is being developed but poor flexibility similar to that in the glass cutting or cleaving process using carbon dioxide lasers is expected. On the other hand, the three common problems associated with laser cutting are also discussed.


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