TITLE

KLA-Tencor Launches Overlay Metrology for 45nm Chips

AUTHOR(S)
Mutschler, Ann Steffora
PUB. DATE
December 2006
SOURCE
Electronic News;12/11/2006, Vol. 52 Issue 50, p34
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
The article reports on the launch of the VisEdge CV300 overlay metrology system by KLA-Tencor Inc. to address the time-to-market yield challenges of 45 nanometer (nm) chip manufacturing. There are demands for an inspection technology capable of detecting the broadest range of defect types. The system is capable of meeting the sub-65 nm wafer-edge inspection requirements. It allows fast yield ramping of immersion lithography tools.
ACCESSION #
23509812

 

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