TITLE

Environmental and Mechanical Stress Testing of Pb-Free and SnPb Solder

AUTHOR(S)
Fisher, Larry
PUB. DATE
September 2006
SOURCE
Circuits Assembly;Sep2006, Vol. 17 Issue 9, p54
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
The article provides information on a study which tested lead-free and tin-lead (SnPb) solder using environmental and mechanical stress methods. Various components were hand-soldered to a compliant test board. No real failures were noted although results showed clear differences between SnPb and lead-free solders. Lead-free solder appeared superior to SnPb in terms of lead pull strength. SnPb was significantly stronger than lead-free in terms of shear force strength and both SnPb and lead-free shear force strengths degraded after accelerated age conditioning.
ACCESSION #
22688341

 

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