TITLE

Freescale Unveils Packaging Breakthrough

PUB. DATE
July 2006
SOURCE
Electronic News;7/31/2006, Vol. 52 Issue 31, p43
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
The article reports on the launch of a redistributed chip packaging technology from Freescale Semiconductor. It says that the technology which could replace ball grid array and flip chip simplifies assembly, lower costs and offers compatibility. A statement was issued by Sumit Sadana, chief technology officer for Freescale, on the limitations of standard semiconductor packaging.
ACCESSION #
21893778

 

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