Freescale Unveils Packaging Breakthrough

July 2006
Electronic News;7/31/2006, Vol. 52 Issue 31, p43
Trade Publication
The article reports on the launch of a redistributed chip packaging technology from Freescale Semiconductor. It says that the technology which could replace ball grid array and flip chip simplifies assembly, lower costs and offers compatibility. A statement was issued by Sumit Sadana, chief technology officer for Freescale, on the limitations of standard semiconductor packaging.


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