Wet lithography gives TI edge on 45mm process

Wilson, Richard
June 2006
Electronics Weekly;6/21/2006, Issue 2246, p17
Trade Publication
This article reports that Texas Instruments Inc. will double the number of chips produced on each silicon wafer. Presenting details of its 45nm process at last week's symposium on VLSI Technology, the firm also said the process, based on so-called 'wet' lithography, would increase performance of its DSP devices by 30 percent while reducing power consumption 40 percent. In practice, the processing performance increase achievable with this next generation chip fabrication will translate into higher quality video on mobile phones and greater potential for terminals to run simultaneous applications.


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