TITLE

UMC Goes Green

PUB. DATE
June 2006
SOURCE
Electronic News;6/19/2006, Vol. 52 Issue 25, p27
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
The article reports on the Hazardous Substance Process Management (HSPM) certification to be achieved by Taiwan-based semiconductor foundry UMC. HSPM is the standard that the International Electrotechnical Commission Quality Assessment System for Electronic Components approved for Hazardous Substance Process Management. According to UMC the requirements it met in its HSPM compliance go above and beyond the six listed materials in the Restriction of the use of certain Hazardous Substances guidelines to include the restriction of over 20 different hazardous substances.
ACCESSION #
21405709

 

Related Articles

  • Silicon foundries must change their business model in order to survive. Manners, David // Electronics Weekly;2/5/2003, Issue 2085, p5 

    Contends that the silicon foundry business model must change in order for firms to recover from low profit margins and low growth rates. Move of UMC to change its business model; Impact of growth decline on silicon foundries.

  • SYNOPSYS/UMC RELEASE 65-NANOMETER LOW POWER DESIGN FLOW.  // Electro Manufacturing;Jul2008, Vol. 21 Issue 7, p8 

    The article reports that Synopsys Inc. and UMC have released a low power design reference flow supporting the latter's 65-nanometer technology. The reference design flow includes comprehensive RTL-to-GDSII design capabilities based on the Unified Power Format (UPF) standard. The design flow...

  • UMC posts yet another sales drop for February. Taylor, Colleen // Electronic News;3/19/2007, Vol. 53 Issue 12, p2 

    The article reports on a decline in net sales incurred by Taiwan-based foundry United Microelectronics Corp. in February 2007. As a worldwide inventory backup continued to plague the semiconductor industry, the company went on to post even lower numbers in October 2006 and then again saw a...

  • UMC Produces Xilinx FPGAs with Triple-Oxide 90nm.  // Electronic News;6/21/2004, Vol. 50 Issue 25, pN.PAG 

    Focuses on the triple-oxide process used by Taiwanese semiconductor firm UMC to manufacture Xilinx's Virtex-4 FPGA products. Benefits of the process; Remarks from Erich Goetting, vice president and general manager of the advanced products division of Xilinx, on the advantage of using...

  • Foundry opens NAND memory to fabless firms. Manners, David // Electronics Weekly;4/26/2006, Issue 2238, p7 

    The article reports that the Taiwanese silicon foundry, UMC Corp. has announced an NROM-type process used for NAND flash memory as an alternative to the floating gate CMOS process used by NAND flash leaders such as Toshiba, SanDisk and Samsung. NAND flash memory is one of the fastest growing...

  • Image Sensor Startup Scores $12M in Funding.  // Electronic News (10616624); 

    Reports on the funds received by IC Media Corp., a developer of complementary metal oxide semiconductors image sensors, in a Series D round of financing led by UMC Capital on January 3, 2005. Amount of money invested by UMC in IC Media in 2004; Background of IC Media; Purposes of the funds.

  • UMC, Melexis collaborate on automotive ICs. Mutschler, Ann Steffora // Electronic News;7/16/2007, Vol. 53 Issue 29, p4 

    The article reports that semiconductor foundry UMC revealed that, based on a collaboration with automotive integrated circuit (IC) maker Melexis, chips fabbed on the 0.18-micron eFlash process and eFlash macro of UMC are heading for auto-module producers for assembly in diversified automobile...

  • WORLDWIDE HIGHLIGHTS.  // Solid State Technology;Feb2001, Vol. 44 Issue 2, p20 

    Presents news briefs related to the semiconductor manufacturing industry as of February 2001. Plan of Intel company to begin the production of its wafer fabrication plant in Ireland in 2002; Reason behind the move of Winbond company in Taiwan to cancel the construction of small-scale...

  • UMC Moves to 65nm X Architecture Designs.  // Electronic News;5/29/2006, Vol. 52 Issue 22, p26 

    The article reports that UMC and Cadence Design Systems Inc. has announced the readiness of UMC's 65nm process technology for X Architecture-based chip designs on May 29, 2006. The two companies claim to have successfully qualified 65nm X Architecture design rules, the Cadence X Architecture and...

Share

Read the Article

Courtesy of VIRGINIA BEACH PUBLIC LIBRARY AND SYSTEM

Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics