Lead-free: Reduce Joint Cracks in Automotive Electronics

Irisawa, Atushi
June 2006
SMT: Surface Mount Technology;Jun2006, Vol. 20 Issue 6, p39
The article discusses the development of a higher-reliability lead-free solder to withstand harsh on-board automotive electronics environments. The transition to lead-free solder was adopted to comply with the Restriction on Hazardous Substance Directive of the European Union. The new solder provides solutions to durability issues in tin/silver/copper-type solder alloys, which are used by electronic manufacturers as alternative for conventional tin/lead solder alloys.


Related Articles

  • The RoHS Transition: An EMS View. Rutledge, Art // SMT: Surface Mount Technology;Jun2006, Vol. 20 Issue 6, p34 

    The article issues the approach for conversion of electronic manufacturing process to comply with the Restriction on Hazardous Substances (RoHS) Directive of the European Union. RoHS Directive promotes lead-free electronics manufacturing processes. Overview of the factors that electronic...

  • Overcoming Lower Wetting Forces of Pb-Free Alloys. Oresjo, Stig // Circuits Assembly;Mar2005, Vol. 16 Issue 3, p40 

    The article discusses that several types of defects are likely to increase with lead-free processes, defects that can be mitigated through certain test and inspection methods. The defects that are expected to increase are misalignments, bridging, opens, tombstoning, voids and barrel fill...

  • Process Considerations for Optimizing a Reflow Profile. Barbini, Denis; Diepstraten, Gerjan; Marquez, Ursula // SMT: Surface Mount Technology;Jul2005, Vol. 19 Issue 7, p28 

    This article addresses the question of whether the materials used in the reflow process, especially the solder paste, can meet the high-speed lead-free reflow soldering requirements. It is believed that the ultimate goal of the reflow soldering process is to form reliable solder joints while...

  • Pb-free Design and Process Optimization for PIH. Fockenberger, Harald; Ho, Terence; Pfennich, Gerhard; Shangguan, Dongkai; Leow Ching Tat // Connector Specifier;Oct2005, Vol. 21 Issue 10, p14 

    Examines the results of the board design and process optimization for paste-in-hole (PIH) electronics using lead-free solder. Relationship between several design and process variables and PIH solder joint quality; Observations on hole-filling behavior, solder joint volume and reliability;...

  • Lead-free Selective Soldering: Soft Cost Considerations. Goldberg, Gary // SMT: Surface Mount Technology;Jun2005, Vol. 19 Issue 6, p20 

    Focuses on the growing popularity of selective soldering in manufacturing processes particularly on non-contact laser soldering technologies for lead-free alloys. Development and features of laser soldering; Significance of variable beam technology in laser soldering; Advantages of using laser...

  • Lead-Free Cleaning: Moving from Eutectic to Lead-free. Tosun, Umut // SMT: Surface Mount Technology;Jun2005, Vol. 19 Issue 6, p47 

    Presents the sixth part of a series of articles which explores lead-free cleaning and the development of alternative solder paste. Impact of lead-free solder pastes on the cleaning processes; Cleaning agents used in the electronics industry; Removal of unsoldered solder paste and flux residue.

  • Head-In-Pillow and Hybrid Solder Pastes. Shea, Chrys // Circuits Assembly;Dec2008, Vol. 19 Issue 12, p37 

    The author considers the prevalence of head-in-pillow (HIP) in assembly lines running lead-free reflow processes. She mentions the increasing incidence of HIP in tin-lead processes. She describes hybrid solder pastes. She emphasizes that voiding concerns are still relatively the same whether the...

  • Lead-free rework. Brown, Craig // Electronics Weekly;11/3/2004 Supplement, p8 

    This article presents information about lead-free soldering. Reworking array package components using lead-free solder follows similar steps to leaded components with eutectic solder. It involves establishing the thermal profile, removing the failed component, placing a new component with flux...

  • Lead-free Cleaning Studies Abound. Kenyon, William G. // SMT: Surface Mount Technology;Jul2005, Vol. 19 Issue 7, p14 

    The article presents information about various studies on lead-free assembly processes. To help customers make the transition to lead-free, and to be in a position to answer the cleaning needs of the electronics industry, one cleaning agent supplier has begun a cleaning study of lead-free solder...


Read the Article


Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics