TITLE

Lead-free: Reduce Joint Cracks in Automotive Electronics

AUTHOR(S)
Irisawa, Atushi
PUB. DATE
June 2006
SOURCE
SMT: Surface Mount Technology;Jun2006, Vol. 20 Issue 6, p39
SOURCE TYPE
Periodical
DOC. TYPE
Article
ABSTRACT
The article discusses the development of a higher-reliability lead-free solder to withstand harsh on-board automotive electronics environments. The transition to lead-free solder was adopted to comply with the Restriction on Hazardous Substance Directive of the European Union. The new solder provides solutions to durability issues in tin/silver/copper-type solder alloys, which are used by electronic manufacturers as alternative for conventional tin/lead solder alloys.
ACCESSION #
21387936

 

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